An Experimental Approach for Studying Creep Behavior of Model Planar Interfaces

Abstract

An apparatus for measuring the steady state creep behavior of interfaces in aluminum-silicon-aluminum multilayered specimens has been assembled. In the experiment scheme, a double-shear specimen geometry was used to load the interfaces in a state of nominally constant shear. The deformation kinetics for interfacial sliding during constant shear stress creep experiments were measured for various applied interfacial shear Stress levels and temperatures. Interfacial shear strain rates were measured using displacement and capacitance gauges. The planar interfaces between the aluminum and silicon layers were prepared by diffusion bonding. Preliminary results indicate that that interfacial sliding occurs via time-dependent relaxation mechanisms and that there is a threshold stress for interfacial sliding, in agreement with previous work on lead-Quartz and lead- nickel interfaces.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 2000
Accession Number
ADA380799

Entities

People

  • Keith A. Peterson

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Ceramic Matrix Composites
  • Chemistry
  • Composite Materials
  • Creep
  • Creep Tests
  • Diffusion Bonding
  • Geometry
  • Materials
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Mechanical Engineering
  • Mechanical Working
  • Mechanics
  • Shear Stresses
  • Stresses

Readers

  • Materials Science (Mechanical Engineering).
  • Mechanical Engineering/Mechanics of Materials.