Adherend Thermal Effects During Bonding with Inductively Heated Films

Abstract

The thermal performance of an inductively heated film sandwiched between two identical adherends is investigated. Models for infinite conductivity finite thickness adherends, finite conductivity semi-infinite thickness adherends, and finite conductivity finite thickness adherends are presented. Calculations are performed for polymer-matrix composite, ceramic, and metal adherends for a variety of adherend thicknesses. The results show that for expected bonding applications, film heating rates will be reduced by a factor of l0-l00, as compared with insulated film heating rates with no attached adherends. Higher reductions in heating performance are noted for ceramic and metal adherends as compared with composite adherends. However, even with the most severe reductions in heating rates, bonding with inductively heated films is feasible.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 2001
Accession Number
ADA389305

Entities

People

  • Brice K. Fink
  • Eric D. Wetzel

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Ground and Sea Platforms
  • Sensors
  • Weapons Technologies

DTIC Thesaurus Topics

  • Ceramic Materials
  • Composite Materials
  • Conduction (Heat Transfer)
  • Conductivity
  • Ferrites
  • Heat Capacity
  • Heat Transfer
  • Materials
  • Materials Laboratories
  • Materials Science
  • Military Research
  • Polymer Matrix Composites
  • Polymeric Films
  • Specific Heat
  • Thermal Conductivity
  • Thermal Diffusivity
  • Thermophysical Properties

Readers

  • Combustion and Flow Dynamics.
  • Reinforced Composite Materials
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene