Readout Technology for > 1K x 1K Staring Focal Plane Arrays
Abstract
Until recently very large focal plane arrays (> 1K x 1K pixels) could only be fabricated using low density >= 2 micrometers CMOS processes employing frill wafer projection lithography. Higher density processes use steppers to expose the patterns on the wafer which have limited the die size to the area able to be exposed in a single step. This placed an upper limit on the readout die size of about 18-22 millimeters along a side. While stitching techniques have been used to pattern larger die most silicon foundries are unwilling to accept such projects.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1999
- Accession Number
- ADA390473
Entities
People
- A. E. Gin
- C. L. Fletcher
- D. J. Gulbransen
- J. P. Curzan
- R. H. Wyles
Organizations
- RTX