Thermal Strain-Induced Temperature Compensation of Diode Lasers
Abstract
We have explored both monolithic and hybrid assembly techniques, with miniaturization the main goal in either case. The hybrid approach that we will describe makes use of a submount of dimensions comparable to those used on standard laser manufacturing, but made from a material chosen for a specific thermal expansion coefficient, either high or low compared to Inp, to obtain either enhanced or reduced temperature tuning. To increase the effectiveness of the differential expansion, we also developed a strain magnifying structure based on a deep crystallographic etch from the back of the substrate. One appeal of this hybrid technique is that the same basic technology can be applied to either tuning enhancement or reduction, by simply using a different submount. However, the ultimate in cost reduction and reliability would be obtained with a truly monolithic approach, and toward this end, we studied the properties of a high-expansion electroplated manganese film to serve as a stress inducing layer.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 15, 2000
- Accession Number
- ADA390668
Entities
People
- L.A. Coldren
Organizations
- University of California, Santa Barbara