Thermal Characterization and Process Modification of an RTM Epoxy Resin
Abstract
The Materials and Structures Division at NAVAIRSYSCOM have teamed together along with industry to demonstrate to a high level of confidence the viability of an agile resin transfer molding (RTM) manufacturing process, also know as intelligent processing, Utilizing fabrication, analysis, modeling and testing efforts, this program will provide an assessment of the Northwestern University's advanced injector system. This paper's objective is to thermally characterize the selected SI-ZG-5A epoxy resin, formulated by A.T.A.R.D Laboratories. This analysis consists of a comprehensive program of resin characterization and cure modeling. Modulated Differential Scanning Calorimetry (MDSC), rheology measurements and thermogravimetric analysis (TGA) were used to determine the cure kinetics, glass transitions, processing temperature and volatiles during cure. The manufacturer's recommended cure cycle was followed in order to establish a reference glass transition, enthalpy of cure and gel point during cure. Once this analysis was complete, variations of the cure cycle were performed in order to determine if the cure cycle could be modified. Cure kinetics were also determined using the variable heating rate method. In conclusion, the SI ZG-5A resin system has been found to be a robust RTM resin by being forgiving of process variation. However, the effect of these variations on final mechanical properties is still be determined.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 25, 2001
- Accession Number
- ADA393323
Entities
People
- Neil Graf
- Peter Joyce
- Robert Boswell
Organizations
- Naval Air Warfare Center