Development of a Dielectric Based Non-Destructive Examination Method for Adhesive Bonded Structures: A Fundamental Study. Investigation of Dielectric Methods for the Characterization of Adhesive Bonded Structures

Abstract

The report covers work carried out by students at the University of Strathclyde evaluating the application of the dielectric technique to the characterisation of ageing in adhesive bonded structures. The work covers studies of aluminium-epoxy-aluminium and carbon fibre-epoxy-carbon fibre. The ageing in these structures was induced by exposing samples to high humidity and elevated temperatures and revealed the possible correlations between the changes in dielectric property and changes in mechanical property in the joints. This study has established the potential of applying the dielectric technique for the non-destructive analysis of adhesive bonded structures.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2000
Accession Number
ADA396429

Entities

People

  • D. Hayward
  • R. A. Pethrick

Organizations

  • University of Strathclyde

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Aluminum Oxides
  • Carbon Fiber Reinforced Polymer
  • Carbon Fibers
  • Chemistry
  • Composite Materials
  • Dielectric Permittivity
  • Dielectric Properties
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Physical Properties
  • Resins

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Polymer Science and Engineering.
  • Theoretical Analysis.