Thermal Stability of NI/NI3AL Nanolayered Materials

Abstract

The purpose of the research is to study the morphological stability of Ni/Ni3A1 layered materials, as a function of interfacial orientational relationships, columnar grain dimensions, bilayer thickness, applied stress, and temperature. This report describes our efforts over the past year to model critical features which control the strength of interfaces to dislocation transmission, and to study the morphological stability of Ni(Al)/Ni3Al that are heated to elevated temperature for prolonged periods. These two areas are critical to optimizing both the plastic strength and elevated temperature stability of nanoscale materials. This final report describes our efforts to both model the thermal stability of Ni/Ni3A1 layered materials and to conduct experiments to determine the temperature and time scales over which the layered morphology in such materials may break down.

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Document Details

Document Type
Technical Report
Publication Date
Dec 10, 2001
Accession Number
ADA397380

Entities

People

  • H.L. Fraser
  • Peter M. Anderson

Organizations

  • Ohio State University

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Composite Materials
  • Crystals
  • Dislocations
  • Films
  • Geometry
  • Grain Boundaries
  • Materials
  • Materials Science
  • Mechanical Properties
  • Mechanics
  • Modulus Of Elasticity
  • Particles
  • Phase Diagrams
  • Phase Transformations
  • Thermal Stability
  • Thickness
  • Thin Films

Fields of Study

  • Physics

Readers

  • Control Systems Engineering.
  • Materials Science and Engineering.
  • Thin Film Deposition Science.