Thermochemical Response of Vinyl-Ester Resin

Abstract

This report presents the thermochemical characterization of Dow Derakane 411-C50 commercial vinyl-ester resin at low temperatures (20 deg - 40 deg C). Differential scanning calorimetry (DSC) and torsional braid analysis (TBA) are the experimental techniques used to characterize the material behavior. The cure kinetics are studied using DSC and are modeled using a modified autocatalytic equation with a maximum degree of cure term. Also, the effect of inhibitors in the resin system is accounted for by an inhibitor depletion model. A time-temperature-transformation diagram is constructed for the material by measuring the times to gelation and vitrification using TBA. The glass transition temperature (T(sub g)) is also characterized using the TBA and related to the degree of cure. It was found that the T(sub g) and the degree of cure do not exhibit a linear relationship for this resin system. The findings presented in this work provide information for accurate cure modeling and process simulation of vinyl-ester materials.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2002
Accession Number
ADA399117

Entities

People

  • Bruce K. Fink
  • John W. Gillespie Jr.
  • Molly A. Stone
  • Travis A. Bogetti

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies
  • Human Systems
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Alkenes
  • Chemical Reactions
  • Chemistry
  • Composite Materials
  • Equations
  • Glass Transition Temperature
  • Low Temperature
  • Materials
  • Materials Science
  • Mechanical Properties
  • Mechanics
  • Military Research
  • Phase Transformations
  • Resins
  • Thermosetting Plastics
  • Transition Temperature
  • Transitions

Fields of Study

  • Materials science

Readers

  • Computational Modeling and Simulation
  • Polymer Science and Engineering.