Multispectral HDVIP Focal Plane Arrays

Abstract

The High-Density Vertically Interconnected Photodiode (HDVIPTM) architecture developed at Texas Instruments is now the basis of staring focal plane arrays fabricated by RTIS FPA Business unit. The architecture has been demonstrated to produce high performance, large area scanning and staring arrays, including the world's first true long-wave (>10 m cutoff) 480x640 staring array. In this paper we report on extending the monocolor HDVIP architecture to multispectral arrays capable of simultaneously detection of 2 or more spectral bands.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1998
Accession Number
ADA399260

Entities

People

  • A. Turner
  • B. Seymour
  • H. Schaake
  • P. Dreiske
  • R. Keller

Organizations

  • RTX

Tags

Communities of Interest

  • Advanced Electronics
  • Sensors

DTIC Thesaurus Topics

  • Antireflection Coatings
  • Area Scanning
  • Arrays
  • Coatings
  • Detection
  • Detectors
  • Diodes
  • Etching
  • Fabrication
  • Focal Plane Arrays
  • Focal Planes
  • Implantation
  • Ion Implantation
  • Ions
  • Materials
  • Multispectral
  • Reactive Ion Etching

Readers

  • Image Processing and Computer Vision.
  • Phased Array Antenna Design.

Technology Areas

  • Directed Energy