2048X2048 HgCdTe FPA
Abstract
Rockwell has begun developing infrared FPAs in the 2048(2) format. The first is the HAWAII-2, an infrared 2048(2) focal plane array (FPA) for next-generation infrared astronomy. It will supplant our HAWAII 1024(2) as the largest high-performance infrared imager available. As with our prior infrared FPAs, the flip-chip hybrid will consist of a low dark current, low-capacitance HgCdTe detector array mated to a low-noise CMOS silicon multiplexer via indium interconnects. The FPA's 18 micrometers pixel pitch accommodates both reasonable telescope optics and fabrication of the large, low-noise readout (approximately equal 40 x 40 mm(2)) using world-class submicron CMOS.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1998
- Accession Number
- ADA400006
Entities
People
- K. Hodapp
- K. Vural
- L. J. Lozlowski
- W. E. Kleinhans