Broad Applications of Diffusion Bonding

Abstract

Results are presented of a study of the broad application of diffusion bonding. A comprehensive literature survey of the present status of diffusion bonding was been conducted and the information incorporated in the report. The relevant aspects of 'Diffusion Theory' was been outlined, followed by a detailed discussion of the fundamental factors governing the diffusion bonding process. The status of the process has been delineated through a presentation of the practical applications and the experimental data on diffusion bonding. Consideration has been given to the development of a logical framework for the selection of a diffusion bonding technique for new Joining applications. Areas in which further work is needed for developing the reliability of the process and broadening its applications have been described. Finally, the future potential of diffusion bonding has been reviewed by outlining the material characteristics and structures which appear to be amenable to Joining by diffusion bonding. This study will provide assistance in the selection or rejection of a diffusion bonding technique for specific Joining applications.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1966
Accession Number
ADA400448

Entities

People

  • A. J. Ranadive
  • B. R. Garrett
  • G. F. Blank

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Bonding
  • Chemistry
  • Construction
  • Crystal Structure
  • Heat Resistant Alloys
  • Joining
  • Joints
  • Manufacturing
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Mechanical Working
  • Solid Solutions

Fields of Study

  • Materials science

Readers

  • Business Analytics
  • Mathematical Modeling and Probability Theory.
  • Quantum Chemistry