Suggested Method for Plating Copper on Aluminum

Abstract

The report describes the successful application of the phosphate anodizing process in copper plating commercially pure aluminum and several aluminum alloys; it also lists the advantages-as well as one disadvantage compared with the zincate process in current use by industry.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1966
Accession Number
ADA400819

Entities

Organizations

  • Southwest Research Institute

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Acids
  • Adhesion
  • Alloys
  • Aluminum
  • Aluminum Alloys
  • Ceramic Materials
  • Coatings
  • Compound Semiconductors
  • Current Density
  • Electrical Conductivity
  • Films
  • Hydrofluoric Acid
  • Joints
  • Materials
  • Phosphoric Acids
  • Soldered Joints
  • Substrates

Fields of Study

  • Materials science

Readers

  • Surface Engineering/Surface Coating Technology.