High Performance Packaging of Power Electronics: Role of Thermally Engineered Materials

Abstract

Advantages of new approaches must be demonstrated at the system, e.g., motor drive, level. Device Power Density (A/cm2 or W/cm2 ) System Power Density (W/m3) Lifetime Assurance of Entire System System Cost Analysis Ultimately Required

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Document Details

Document Type
Technical Report
Publication Date
May 30, 2001
Accession Number
ADA401137

Entities

People

  • M. C. Shaw

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Control Systems
  • Cost Analysis
  • Costs
  • Electric Motors
  • Electronics
  • Energy
  • Energy Consumption
  • Energy Management
  • Engineered Materials
  • Heat Transfer
  • Heat Transfer Coefficients
  • Materials
  • Mechanics
  • Motors
  • Packaging
  • Power Electronics
  • Silicon Carbide

Fields of Study

  • Physics

Readers

  • Pulsed Power and Plasma Physics.
  • Rocket Propulsion.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems