Material Issues in Thermal Management of RF Power Electronics

Abstract

System Level; Description of system(s); Thermal management issues; Temperature gradients; Absolute temperature levels; Special array-level (AESA) problems; Role of materials at the system level; Component Level; Primary source of thermal dissipation; Unique thermal analysis aspects of RF components; Role of materials at the component level.

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Document Details

Document Type
Technical Report
Publication Date
May 30, 2001
Accession Number
ADA401436

Entities

People

  • Donald C. Price
  • James S. Wilson

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Amplifiers
  • Boundaries
  • Dissipation
  • Electronics
  • Heat Flux
  • Materials
  • Phased Array Radar
  • Phased Arrays
  • Power
  • Power Amplifiers
  • Power Converters
  • Power Electronics
  • Radio Frequency Power
  • Silicon Carbide
  • Temperature Control
  • Temperature Gradients
  • Thermal Analysis

Readers

  • Electrical Engineering
  • Systems Analysis and Design
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics