Thermal-Fluid Analysis and Simulation of High Power Solid-State Laser Diode (SLD) Assemblies

Abstract

The thermal configuration is an important factor determining the successful operation of the high power solid-state laser diode assemblies. The solid-state diode array in an H-package using a conventional water-cooling flow was analyzed using a combined thermal and fluid finite element codes. A successful convergent solution was reached for the typical operation conditions. The results of the temperature and fluid velocity fields were reported and were compared reasonably with the experimental results.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 2002
Accession Number
ADA403691

Entities

People

  • C. T. Tsai
  • L. L. Liou
  • X. A. Zhu

Organizations

  • Florida Atlantic University

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Assembly
  • Computational Fluid Dynamics
  • Cooling
  • Differential Equations
  • Equations
  • Failure Mode And Effect Analysis
  • Fluid Dynamics
  • Fluid Flow
  • Laser Diodes
  • Lasers
  • Semiconductor Lasers
  • Simulations
  • Solid State Lasers
  • Stratified Fluids
  • Water Cooling

Readers

  • Combustion and Flow Dynamics.
  • Electrical Engineering
  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)

Technology Areas

  • Directed Energy