Direct Cooling of Propulsion drives for High Power Density and Low Volume

Abstract

The first Annual Report summarizes the activities performed on this grant from May 1, 2001, through June 30, 2002. One graduate student has been working on the overall direct cooling system design and packaging philosophy of our high-voltage, spray-cooled power module. Two other graduate students have investigated solution strategies for connecting IGBTs in series which are amenable to miniaturization and integration for our direct cooling packaging strategy. Finally, another graduate student has been working on novel SiC transistors for use in high-temperature power electronics packaging.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2002
Accession Number
ADA404055

Entities

People

  • Fred D. Barlow
  • Juan C. Balda
  • Kraig J. Olejniczak

Organizations

  • University of Arkansas

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Ground and Sea Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Diodes
  • Electrical Engineering
  • Electronic Components
  • Electronics
  • Electronics Industry
  • Heat Transfer
  • Heat Transfer Coefficients
  • High Temperature
  • High Voltage
  • Power Electronics
  • Semiconductor Devices
  • Semiconductors
  • Silicon Carbide
  • Thermal Conductivity
  • Transistors
  • Voltage

Readers

  • Electrical Engineering
  • Integrated Circuit Design and Technology.
  • Research Science/Academic Research

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems