Lebensdauerabschaetzung von Loetverbindugen oberflacechenmontierter Bauteile be thermischer Wechselbeanspruchung unter Beruechtigung der Bedeutung elastischer, plastischer und Kreichdehnungsanteile (Longevity of Taft Joints of Superficially Mounted Construction Parts in Thermally Alternating Stress with regard to the Significance of Elastic, Plastic and Creep Parts)

Abstract

The goal of this study is the refinement of the technique of low-frequency fatigue analyses of a Taft joint through computer simulation, in order to obtain, in the shortest time possible, a more precise expression of their longevity. To answer the central query, 'how long does the Taft joint hold?', there exists a series of concomitant questions, around which the study centers: on what kind of Taft joint longevity can one count; how are the Taft joint data dependent on mechanical tension, time, and temperature; which conditions promote the ideal results; what must be taken into account during the cross-linkage of the Taft joint for finite element analysis; which temperature should be chosen in order to re-portray the themocycles in a low-frequency fatigue analysis as realistically as possible; and locating the critical geometric places within the Taft joint.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1999
Accession Number
ADA408336

Entities

People

  • Andreas Warnke

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  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Circuit Boards
  • Electronic Components
  • Electronic Equipment
  • Fatigue Life
  • Finite Element Analysis
  • Manufacturing
  • Materials
  • Mechanical Properties
  • Mechanics
  • New York
  • Printed Circuit Boards
  • Printed Circuits
  • Semiconductor Devices
  • Simulations
  • Test Methods
  • Thermal Stresses

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