Vacuum Packaging for Microelectromechanical Systems (MEMS)
Abstract
The Vacuum Packaging for MEMS Program focused on the development of an integrated set of packaging technologies which in totality provide a low cost, high volume product-neutral vacuum packaging capability which addresses all MEMS vacuum packaging requirements. The program balanced the need for near term component and wafer-level vacuum packaging with the development of advanced high density wafer-level packaging solutions. Three vacuum packaging approaches were pursued: large area component level; 4"/6" wafer-level; and wafer-level microshell encapsulation. The program focused on packaging for MEMS accelerometers and gyros; IR MEMS a-Si microbolometer and ferroelectric detectors; and RF MEMS resonators. Successful demonstrations were accomplished with IR MEMS microbolometers in sub 10 mTorr vacuum packages, inertial MEMS resonant accelerometers in sub 200 mTorr vacuum packages and an RF MEMS resonator demonstration. In addition to the successful demonstrations, numerous component and wafer-level vacuum packages passed extensive MIL standard environmental tests.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 2002
- Accession Number
- ADA408406
Entities
People
- Martin Schmidt
- Roger Howe
- Steve Montague
- Thomas Schimert
Organizations
- RTX