Development of Processable, Low Cure Shrinkage Adhesives
Abstract
Adhesively bonded structures offer weight savings, ease of fabrication, and absence of stress concentrations arising from holes and fasteners. However, the drawbacks of current high performance resins, i.e. high paste viscosity and chemical cure shrinkage, often present uncertainties in the quality and durability of the bondlines. This program presents methodologies and approaches that seek to mitigate these difficulties through innovative chemical modifications and blending of monomers.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 2003
- Accession Number
- ADA411520
Entities
People
- Christopher D. Simone
- Chuk L. Leung
- Daniel A. Scola
- Parag Katijar