Analysis and Support Initiative for Structural Technology (ASIST) Delivery Order 0016: USAF Damage Tolerant Design Handbook: Guidelines For the Analysis and Design of Damage Tolerant Aircraft Structures

Abstract

This is an electronic version of the revised U.S. Air Force Damage Tolerant Design Handbook. The technical content of the 2002 edition is enhanced by the addition of new developments in the areas of corrosion, widespread fatigue damage, and probabilistic methods. New sample problems are included which illustrate the stress intensity factor calculation, fatigue crack life prediction, residual strength risk assessment, resistance curves, inspection intervals, and analysis of aircraft areas, including longeron, wing spars, windshield doubler, fuselage skin, lap joints, layered structure, and flat panels. The revised handbook has 11 sections. An overview of MIL-HDBK-1530 ASIP Guidance and design guidelines specified in the Joint Service Specification Guide (JSSG-2006), and an overview of sustainment in aging aircraft, have been included in Section 1. The handbook provides guidance for analysis and design of damage tolerant aircraft structures.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 2002
Accession Number
ADA411872

Entities

People

  • Alan P. Berens
  • Allan Gunderson
  • J. P. Gallagher
  • Peggy C. Miedlar

Organizations

  • University of Dayton

Tags

Communities of Interest

  • Air Platforms
  • Counter WMD
  • Cyber
  • Energy and Power Technologies
  • Ground and Sea Platforms
  • Space

DTIC Thesaurus Topics

  • Air Force
  • Aircraft Equipment
  • Aircraft Industry
  • Aircrafts
  • Airframes
  • Computational Science
  • Databases
  • Information Science
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Mechanical Working
  • Mechanics
  • Stress Strain Relations
  • Surveys
  • Test Methods
  • Transport Aircraft

Readers

  • Aerospace logistics and air mobility.
  • Business Analytics
  • Materials Science (Mechanical Engineering).

Technology Areas

  • Microelectronics