Thermophysical Properties and Phase Equilibria of Materials Systems

Abstract

The objective is to improve thermal expansion, specific heat, molar volume, and bulk moduli predictions at the highest temperatures and pressures. In those regions experiments are difficult and data is often marginally reliable. In a series of papers, we have developed models for predicting these properties for a wide range of metals, ceramics and semiconductors. By considering the influence of thermal defects on thermal expansion it has been possible to provide a quantitative relationship for thermal expansion and molar volume from near absolute zero to the melting point for refractory metals aluminum and copper. Over the course of the project we have combined our improved properties with finite element methods to calculate residual stresses important for the fabrication and reliability of group Ill-V Nitride devices and tungsten carbide.

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Document Details

Document Type
Technical Report
Publication Date
Jun 27, 2002
Accession Number
ADA413930

Entities

People

  • D. Brenner
  • John Prater
  • Ke Wang
  • R. R. Reeber

Organizations

  • North Carolina State University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Carbides
  • Elements
  • Fabrication
  • Finite Element Analysis
  • High Temperature
  • Materials
  • Materials Processing
  • Materials Science
  • Melting Point
  • Metals
  • Refractory Metals
  • Residual Stress
  • Semiconductors
  • Thermal Expansion
  • Thermophysical Properties
  • Tungsten
  • Tungsten Carbides

Readers

  • Computational Modeling and Simulation
  • Organic Chemistry
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics