Thermal Conductivity Evaluation of Initial Stage Phenomena
Abstract
The onset of sinter bonding and concomitant handling strength is a critical period in the processing of powder metallurgy materials. Mechanical characterization of this evolution during predensification sintering is difficult, due to the fragile nature of the materials. Thermal properties such as thermal diffusivity and thermal conductivity also evolve during the onset of sinter bonding. This research investigates the potential for assessing mechanical strength through thermal conductivity evaluation, using the non-contact technique of laser flash analysis. Thermal conductivity and transverse rupture strength were evaluated for a nickel powder system in three different formats: injection-molded, low-density die-compacted, and high-density die-compacted. Measurements focused on post-sintering strength and thermal conductivity evolution from 20 to 700 deg C for the first two formats. In situ strength was evaluated for the high-density die-compacted material. Thermal conductivity was demonstrated to be a linear function of neck diameter, versus a function of the neck area as anticipated. Strength evaluation confirmed previous research that strength is a function of the neck area. Based on both properties' dependence on neck size, an integrated relationship was constructed, allowing mechanical strength to be directly predicted from thermal conductivity measurement for the given system.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 2003
- Accession Number
- ADA416947
Entities
People
- Constance E
Organizations
- Pennsylvania State University