Factors Affecting Creep in Gold on Silicon Bi-Layer Mems Cantilevered Beams

Abstract

This research identifies factors that contribute to creep in bi-layer gold on polysilicon MEMS beams. Beams used in this research were manufactured using the Multi-User MEMS Process (MUMPs). Their thicknesses were 2(micrometer) or 4(micrometers) (O.5(micrometers) gold on either 1.5(micrometers) or 3.5(micrometers) polysilicon), these beams were all 20(micrometers) wide and ranged in length from 80(micrometers) to 280(micrometers) in increments of 40(micrometers). Numerous thermal cycling tests and isothermal hold experiments were conducted at various temperatures. Initial thermal cycling took place at temperatures ranging from room temperature to 275 degrees C, and time durations ranging from 5 to 400 minutes. Isothermal hold experiments were conducted at temperatures ranging from 30 degrees C to 180 degrees C, all isothermal holds have duration of approximately 200 hours. Data was gathered using a Zygo white light interferometric microscope.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2003
Accession Number
ADA417266

Entities

People

  • Neil E. West

Organizations

  • University of Colorado Boulder

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Creep
  • Creep Tests
  • Crystal Structure
  • Elastic Properties
  • Geometry
  • High Temperature
  • Manufacturing
  • Materials
  • Materials Science
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Microelectromechanical Systems
  • Microscopes
  • Modulus Of Elasticity
  • Shear Modulus
  • Shear Stresses

Fields of Study

  • Physics

Readers

  • Optical Physics and Photonics.
  • Thermal Physics or Thermal Science.
  • Thin Film Deposition Science.