Fundamental Studies of Microstructural Evolution During Friction STIR Welding of Aluminum Alloys

Abstract

This research program was aimed at developing a fundamental understanding of microstructural evolution in FSW Al alloys. The microstructural evolution in FSW-processed alloys is closely connected to the local thermomechanical cycles imposed through the combination of frictional heating and mechanical working by the tool material. The mechanical and corrosion properties of the resultant joints, in turn, are intimately linked to the evolved microstructures. In an effort to understand these relationships, FSW simulations were conducted on monolithic Al 6061 and Al 2195 plates. Thermal fields produced during FSW were determined using infrared (IR) imaging and embedded thermocouples. Efforts have been made to establish the link between the thermal fields and the resultant microstructural evolution in the various FSW zones. Texture evolution in the FSW zones has been evaluated using electron backscatter diffraction (EBSD). The influence of microstructural features on tensile, fatigue, and corrosion behavior is presented.

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Document Details

Document Type
Technical Report
Publication Date
Sep 17, 2003
Accession Number
ADA417803

Entities

People

  • David P. Mika
  • Lisa M. Young
  • Michael B. Larsen
  • Michelle A. Othon
  • Nirm V. Ninnalan
  • P.r. Subramanian
  • Paul L. Dupree
  • Paul Sudkamp

Organizations

  • General Electric

Tags

Communities of Interest

  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Aluminum Alloys
  • Cost Reductions
  • Diffraction
  • Electron Microscopes
  • Fabrication
  • Fatigue Tests (Mechanics)
  • Friction Stir Welding
  • Grain Size
  • Materials
  • Mechanical Properties
  • Mechanical Working
  • Phase Transformations
  • Scattering
  • Stress Corrosion
  • Stress Corrosion Cracking
  • Stress Tests
  • Transitions

Fields of Study

  • Materials science

Readers

  • Coastal Oceanography
  • Powder metallurgy of Titanium alloys.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics