Inductively Coupled Plasma System (ICP)

Abstract

This is the final technical report for contract number F49620-01-1-0307 with the Air Force Office of Scientific Research. The report provides information about the inductively coupled plasma system that was acquired under this contract. The system is a Unaxis Versalock 700, a production level cluster tool for dry etch and dielectric deposition. The tool provides up to 3 process chambers. Currently two of them are in function in our facility: chamber one has been arranged for dry etching of compound semiconductors and chamber two for dielectric deposition (SiN(x) and SiO2). We will describe the system and highlight the added value that the system brought to our cleanroom.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2001
Accession Number
ADA420671

Entities

People

  • Umesh Mishra

Organizations

  • University of California, Santa Barbara

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aspect Ratio
  • Ceramic Materials
  • Chemical Compounds
  • Chemical Vapor Deposition
  • Chemistry
  • Chlorine
  • Compound Semiconductors
  • Contracts
  • Dielectric Films
  • Dry Etching
  • Etching
  • Films
  • Materials
  • Materials Science
  • Radio Frequency Power
  • Scientific Research
  • Semiconductors

Readers

  • Nanofabrication and Microfabrication.
  • Plasma Physics.
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene