Injectable Ceramic Microcast Silicon Carbonitride (SiCN) Microelectromechanical System (MEMS) for Extreme Temperature Environments with Extension: Micro Packages for Nano-Devices
Abstract
MEMS that can survive ultrahigh-temperatures and corrosive environments are important in a variety of unique applications. This work develops an innovative microfabrication technology for high temperature MEMS: microcasting of injectable polymer-derived SiCN ceramic materials. The techniques allow realization of MEMS with complex, three-dimensional and multilayer geometry useable to 1500 C. Our approach is easy and low cost. Several MEMS were realized and evaluated. The objectives of the extension research project are to investigate a new micro-packaging technology to create a high-vacuum, sealed environment for nano-devices integrated with other electronic or RF circuits. The process fits standard manufacturing infrastructure, and can be scaled to package MEMS or nano devices. Such a micro-package will be critical to the advancement of devices such as nano sized resonators that require high vacuum and clean environment to maintain Q's on the order of 10,000 or higher, or very advanced RF MEMS where packaging can greatly affect performance. Two challenges were identified in the initial proposal: the precision creation of the micro-cap, and the deposition of glass droplets in vacuum. The final deliverable for this project was to demonstrate a MEMS sensor hermetically sealed in vacuum. The sensors performance was measured as a function of time to demonstrate the vacuum and hermetic sealing levels.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 2004
- Accession Number
- ADA421314
Entities
People
- John W. Daily
- Martin L. Dunn
- Rishi Raj
- Victor M. Bright
Organizations
- University of Colorado Boulder