Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging

Abstract

Solder joints provide both electrical and mechanical interconnections between a silicon chip and the packaging substrate in an electronic application. The thermomechanical cycling (TMC) in the solder due to the mismatch of the coefficient of thermal expansion (CTE) between the silicon chip and the substrate causes numerous reliability challenges. This situation is aggravated by the ongoing transition to lead-free solders worldwide, and the trend towards larger, hotter-running chips. Therefore, improved solder joints, with higher resistance to creep and low-cycle fatigue, are necessary for future generations of microelectronics. This study reports in the development a process to fabricate solder joints with a fine distribution of shape memory alloys (SMA) NiTi particulates. The microstructure and interface zone of the as-reflowed solder-SMA composite has been characterized.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2004
Accession Number
ADA422317

Entities

People

  • William L. Wright

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Alloys
  • Circuit Boards
  • Composite Materials
  • Electronics
  • Electronics Industry
  • Failure Mode And Effect Analysis
  • Materials
  • Mechanical Working
  • Microelectronics
  • Particle Size
  • Particles
  • Physical Properties
  • Printed Circuits
  • Reliability
  • Resistance
  • Shape Memory Alloys
  • Stresses

Fields of Study

  • Engineering
  • Materials science

Readers

  • Enterprise Information Systems Architecture and Joint Command Capability Interoperability Support.
  • Integrated Circuit Design and Technology.
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems