Neural Composite Materials

Abstract

An embeddable structural health monitoring system has been developed to measure acoustic emission signals generated by incipient damage in Army structures. The structural health monitoring system is built upon two parallel approaches that mimic signal processing in biological nerve cells. One approach uses a continuous sensor formed by a series connection of piezoelectric sensor nodes and a local signal processor to detect damage. The other uses an array type of sensor with appropriate electronics for quantifying damage. Modeling of wave propagation in simple structural elements was performed and the electrical responses of the sensors were simulated. Coupon specimens and panels were also instrumented with the two types of sensors and tested in the laboratory. The simulation and experimental results both confirmed the advantages offered by these sensors for structural health monitoring applications. A prototype of the acoustic emission local processor was also fabricated, and detailed specifications for implementing the algorithms developed in this project into an embeddable VLSI chip are provided. This project resulted in two U.S. patent applications, of which one has already been granted, and two invention disclosures. Commercialization of this technology is currently being pursued.

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Document Details

Document Type
Technical Report
Publication Date
Dec 30, 2003
Accession Number
ADA422526

Entities

People

  • Mannur J. Sundaresan
  • Mark J. Schmiz

Organizations

  • University of North Carolina at Greensboro

Tags

DTIC Thesaurus Topics

  • Acoustic Emissions
  • Composite Materials
  • Computers
  • Detectors
  • Electronics
  • Engineering
  • Laminates
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Nervous System
  • Neurons
  • Patents
  • Signal Processing
  • Simulations
  • Structural Health Monitoring
  • Wave Propagation

Readers

  • Integrated Circuit Design and Technology.
  • Research Science/Academic Research
  • Sensor Fusion and Tracking Systems.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems