Micromechanics Study of a Polymer with/without Microparticles

Abstract

SIEM (Speckle Interferometry with Electron Microscopy) is a micro/nano experimental mechanics technique that is able to perform the full field displacement mapping over a region of only several microns in size. In this study we tested specimens made of a pure binder material, a polymer, and binder material mixed with 6 micron aluminum particles under uniaxial tension. The binder material with microparticles was made by adding 10% by weight aluminum particles into the pure binder material. The technique SIEM was used to map the strain distributions of the specimen under various magnifications, 40x, 200x, 800x, and 1500x. The relationships between the coefficient of variation of epsilon(sub yy), epsilon(sub xx) and the examined area were obtained. We found at magnification about 200x the microstructure had a significant effect on the strain distributions in the binder material with microparticles whereas, for pure binder material, the effect was not observed until at 1500x.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2004
Accession Number
ADA422564

Entities

People

  • Chi Tsieh Liu
  • Fu-pen Chiang
  • Sheng Chang

Organizations

  • Air Force Research Laboratory

Tags

DTIC Thesaurus Topics

  • Air Force Research Laboratories
  • Aluminum
  • Coefficients
  • Electron Microscopes
  • Electron Microscopy
  • Engineering
  • Materials
  • Mechanical Properties
  • Micromechanics
  • Microparticles
  • Microscopes
  • Microscopy
  • Microstructure
  • Particles
  • Photography
  • Spearography
  • White Light

Readers

  • Structural Health Monitoring of Composite Structures.
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics