Grain Size Hardening and Softening in Tungsten Carbide at Low Homologous Temperatures

Abstract

Data in the literature on the effect of grain size d in the range from cm to nm on the flow stress of WC are evaluated, including nanocrystalline materials prepared by a special pulsed laser ablation method. Three grain size regimes were identified: (a) Regime I, d=1O(-2) to O.5x l0(-6) m, (b) Regime II, d=O.5xlO(-6).lO(-8) m and (c) Regime III, d<l0(-8) m. Grain size hardening occurred in Regimes I and II and softening in Regime III. Both straight and tangled dislocations were observed in Regime I. The major influence of grain size in Regime I could result from either its effect on the total dislocation density or the pile-up of dislocations. Insufficient data are available for Regime II to draw any positive conclusions regarding the governing mechanism. Analysis of the grain size softening in Regime III according to our grain boundary shear model yielded a reasonable activation volume. but a lower-than-expected activation energy. The lower energy could be due to the presence of the amorphous NiAl film at the grain boundaries, employed to obtain the nanocrystalline grain size.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2003
Accession Number
ADA422872

Entities

People

  • Hans Conrad
  • Jagdish Narayan

Organizations

  • North Carolina State University

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Boundaries
  • Carbides
  • Crystal Structure
  • Crystals
  • Dislocations
  • Energy
  • Grain Boundaries
  • Grain Size
  • Hardening
  • Heat Of Activation
  • Materials
  • Materials Science
  • Pulsed Lasers
  • Single Crystals
  • Softening
  • Tungsten
  • Tungsten Carbides

Readers

  • Materials Science and Engineering.
  • Pulsed Power and Plasma Physics.

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition