Deep-Level Transient Spectroscopy Study on Double Implanted N(+)-p and p(+)-n 4H-SiC Diodes

Abstract

Planar n+ -p and p + -n junction diodes, fabricated in 411-SiC epitaxial layers using a double-implantation technology (a deep-range acceptor followed by a shallow-range donor implantation and vice versa), are characterized using capacitance deep-level transient spectroscopy (DLTS) to detect deep levels, which may influence device electrical performance. Either Al or B was used as the acceptor, while N or P was used as the donor, with all implants performed at 700 C and annealed at 1600-1650 C with an AlN protection cap. Different traps were observed for the various dopants, which are believed to be related to different impurity-defect complexes. A trap at ^Ev + 0.51 eV was observed in nitrogen-implanted samples, while an acceptor? trap at ^Ev+ 0.28eV and a donor trap at^Ec-0.42eV were observed in Al-implanted samples. A prominent boron-related D-center trap at ^Ev+ 0.63eV is seen in the DLTS spectra of B-implanted diodes. In diodes with implanted phosphorus, three traps at ^Ev+ 0.6eV, Ev+ 0.7eV, and Ev+ 0.92eV, are seen, which are not observed for implantations of other species.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2004
Accession Number
ADA424908

Entities

People

  • K. A. Jones
  • M. Derenge
  • Mulpuri V. Rao
  • N. Papanicolaou
  • Souvick Mitra

Organizations

  • George Mason University

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Electronics Laboratories
  • Energy
  • Field Effect Transistors
  • Heat Of Activation
  • High Temperature
  • Implantation
  • Intensity
  • Ion Implantation
  • Low Temperature
  • Measurement
  • Military Research
  • Point Defects
  • Semiconductors
  • Silicon Carbide
  • Spectra
  • Spectroscopy
  • Universities

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Semiconductor Device Technology