A Micromachined Microjet Array Impingement Cooling Device for High Power Electronics

Abstract

This grant are to simulate and fabricate an optimized micromachined microjet array (MJA) impingement cooling device for high power electronics. A chip-scale microjet impingement cooling device will also be implemented with heat source fabricated on its target plate. There are three main tasks for this project. Task 1 is to develop micromachining processes for the fabrication of the MJA impingement cooling device. Task 2 is to obtain an optimized design for the MJA impingement cooling device based on simulation. Task 3 is to apply the optimized device in an application.

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Document Details

Document Type
Technical Report
Publication Date
May 31, 2004
Accession Number
ADA425124

Entities

People

  • Ajay Malshe
  • Fred Barlow
  • Paneer Selvam
  • Simon S. Ang

Organizations

  • University of Arkansas

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Assembly
  • Civil Engineering
  • Compressible Flow
  • Computational Fluid Dynamics
  • Computers
  • Electrical Engineering
  • Electronics
  • Electronics Industry
  • Fabrication
  • Fluid Mechanics
  • Geometry
  • Heat Transfer
  • Manufacturing
  • Mechanics
  • Power Electronics
  • Simulations
  • Thermal Conductivity

Fields of Study

  • Engineering

Readers

  • Combustion and Flow Dynamics.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems