Polymer Modulator Contact Poling Guide

Abstract

This guide documents the polymer modulator contact poling procedures developed by AFRL/SNDP between 5 Aug 02 and 5 Aug 04, as well as observations and lessons learned during that time. A partly automated, highly functional poling setup is described. CPW-I material samples were tested to determine the optimum poling protocol. Modulators fabricated with a core material consisting of 25% CPW-I by weight in amorphous polycarbonate (APO) yielded a 4.6 volt Vpi. The feasibility of poling an entire wafer at a time was examined, and challenges identified. Another set of modulators were fabricated using deuterated methanol and a core consisting of 29% CPW-I in APO. The best of these devices yielded a 4.2 volt Vpi fand losses comparable to the 25% CPW-I devices, indicating that deuterated methanol possibly reduces loss. 550 volts was determined to be the optimum poling voltage. Another set of devices were fabricated with a core of 35% FN3, a chromophore developed in-house. The best of these devices yielded a 20 volt Vpi. Among key poling issues examined were the appropriate poling temperature, the appropriate time to apply voltage to a sample, and the optimum amount of voltage to apply during poling. Poling induced bleaching is observed. A discussion is included on the information that can be gained from measuring current during poling and observing the profile produced.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 2004
Accession Number
ADA427770

Entities

People

  • Brian M. Flusche
  • Franz Haas

Organizations

  • Rome Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Sensors

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Alcohols
  • Chromophores
  • Electric Fields
  • High Voltage
  • Lessons Learned
  • Light Sources
  • Materials
  • Measurement
  • Methanols
  • Modulators
  • Oxygen Sensors
  • Power Supplies
  • Refractive Index
  • Stainless Steel
  • Vacuum Pumps

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Software Engineering