UV Baked/Cured Photoresist Used as a Sacrificial Layer in MEMS Fabrication

Abstract

MEMS fabrication requires the release of compliant mechanical structures. A sacrificial layer is typically used to provide as a structural layer on which device layers can be deposited and subsequently removed to leave a suspended or freestanding device. There are several sacrificial layers commonly used in MEMS fabrication such as SiOsub2 polysilicon and polyimide. We have developed a sacrificial layer technique that can be used when many other sacrificial layers cannot be used. The use of photoresist that is Ultra Violet (UV) baked/cured as a sacrificial layer can save process steps. time and money. It can also be removed without the inherent problem of residues or stiction from wet processing, material by-products or the problematic issue of determining if the film has been completely removed.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 2005
Accession Number
ADA430096

Entities

People

  • Jeff Pulskamp
  • Ronald G. Polcawich
  • Thomas P. Takacs

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Condensation Reactions
  • Fabrication
  • Glass Transition Temperature
  • High Temperature
  • Manufacturing
  • Materials
  • Mechanical Structure
  • Microelectromechanical Systems
  • Micromachining
  • Military Research
  • Standards
  • Three Dimensional
  • Transition Temperature

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Semiconductor Device Technology