High-Performance, Soft Magnetic Laminates for Aerospace Power Systems

Abstract

Effort has been made to improve high-temperature (^600 degrees C) creep resistance of Fe-Co-V soft magnetic laminates for aerospace power system applications. An innovative approach has been applied to modify the commercial Hiperco 50 (Fe-Co-V) alloy sheets. This approach includes a small amount of cold deformation (with or slightly more than 3 percent) followed by an anneal at 850 degrees C for 3 hours. After the anneal, very large grains of a few hundred micrometers can be readily obtained. The grain size in the modified Fe-Co-V alloy sheets is at least 10 times as large as those in commercial Fe-Co-V alloys. Large grains were obtained in modified Hiperco 27, Hiperco 50A alloy sheets, as well. The large-grain Fe-Co-V alloy sheets demonstrate significantly improved high-temperature creep resistance, especially the initial creep resistance, at 600 degrees C. The creep strains of the Fe-Co-V alloy with large grains are no more than 1/10 to 1/3 of those for the commercial alloys in the initial and middle periods of the test. In addition, Fe-Co-V alloy with large grains displays lower coercivity and higher permeability than the commercial Fe-Co-V alloy.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 2004
Accession Number
ADA430916

Entities

People

  • Shiqiang Liu

Organizations

  • University of Dayton

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Coercivity
  • Composite Materials
  • Creep
  • Creep Tests
  • Crystals
  • Grain Size
  • High Temperature
  • Laminates
  • Magnetic Fields
  • Magnetic Materials
  • Magnetic Properties
  • Materials
  • Mechanical Properties
  • Plastic Deformation
  • Transition Temperature

Fields of Study

  • Materials science

Readers

  • Neurological Diseases/Conditions/Disorders
  • Reinforced Composite Materials
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Space