Wafer Level Micro-Encapsulation

Abstract

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated < 0.1 dB package insertion loss up through 110 GHz and accounts for only 28% of the total packaged RF MEMS circuit cost. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2005
Accession Number
ADA431047

Entities

People

  • Charles L. Goldsmith
  • David I. Forehand

Tags

Communities of Interest

  • Advanced Electronics
  • Sensors

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Dew Point
  • Encapsulation
  • Environment
  • Fabrication
  • Government Procurement
  • Governments
  • Insertion Loss
  • Losses
  • Measurement
  • Microcapsules
  • Microelectromechanical Systems
  • Packaging
  • Standards
  • Test Methods
  • Water Vapor

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.