HPEC Related VITA Standards: An Update

Abstract

As compared to present day IEEE 1101.x standards.... 1. Board Space & Volume (Space-saving methodologies possible; New allocations of PWB thickness for high-density routing and power distribution; Increased secondary-side components heights) 2. Ruggedization (Improved methodologies for "out of the box" MIL-deployable ruggedization) 3. Thermal Management (Unification of air-, conduction-, liquid-flow-thru-, and spray cooling methods; Improve ability to thermally manage secondary side of PWB; Allow for significant thermal planes in the PWB in addition to increased routing layers) 4. Two-level Maintenance (ESD protection at the board level in combination with other improvements; Applies to all cooling methodologies) ....and complementary to IEEE 1101.x standards. There is no intent to "replace" these standards that still are useful in many other applications.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 2004
Accession Number
ADA433638

Entities

People

  • Randy Banton

Tags

Communities of Interest

  • Energy and Power Technologies
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Abstracts
  • Air Cooled
  • Computers
  • Connectors
  • Cooling
  • Frequency
  • High Density
  • Information Operations
  • Intermediate Frequencies
  • Liquid Cooling
  • Maintenance
  • Power Distribution
  • Random Vibration
  • Standards
  • Temperature Control
  • Trade Associations

Readers

  • Electrical Engineering
  • Operations Research

Technology Areas

  • Space