Wafer Level Micropackaging for RF MEMS Switches

Abstract

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2005
Accession Number
ADA433802

Entities

People

  • Charles L. Goldsmith
  • David I. Forehand

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes
  • Sensors

DTIC Thesaurus Topics

  • Abstracts
  • Air Force
  • Air Force Facilities
  • Air Force Research Laboratories
  • Contracts
  • Corporations
  • Department Of Defense
  • Encapsulation
  • Government Procurement
  • Governments
  • Insertion Loss
  • Losses
  • Measurement
  • Microcapsules
  • Military Research
  • Packaging
  • Test Methods

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.