Aerogel and Porous Silicon MEMS for on-Chip Vacuum Packaging

Abstract

The goal of this project is to develop a versatile on-chip vacuum-package technology for surface-micromachined devices. The resulting on-chip encapsulation technology is expected to provide a low-cost, high performance packaging solution for a wide variety of surface micromachined devices, especially micro- and nano-resonators. Our approach is to cover the MEMS structures with a nano-porous membrane before releasing. Release etching is performed by liquid- or gas-phase etching through the permeable membrane. Sealing is achieved by depositing a metal or dielectric film directly on the nano-porous shell in vacuum. Two types of nano-porous materials are developed: thin-film aerogels and porous polysilicon (PPS).

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Document Details

Document Type
Technical Report
Publication Date
Aug 31, 2004
Accession Number
ADA437105

Entities

People

  • Bruce Dunn
  • Chang-jin Kim
  • Ming C. Wu

Organizations

  • University of California, Los Angeles

Tags

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Vapor Deposition
  • Chemistry
  • Coatings
  • Dielectric Films
  • Electrical Engineering
  • Encapsulation
  • Engineering
  • Films
  • High Acceleration
  • Materials
  • Materials Science
  • Mechanical Properties
  • Micromachining
  • Porous Materials
  • Thick Films
  • Thin Films

Readers

  • Integrated Circuit Design and Technology.
  • Nanocomposite Materials Science
  • Nanofabrication and Microfabrication.