A Model to Predict Transient Dielectric-Charging Effects in RF MEMS Capacitive Switches

Abstract

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging methods for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2005
Accession Number
ADA438842

Entities

People

  • Charles L. Goldsmith
  • David I. Forehand
  • James C. M. Hwang
  • Xiaobin Yuan

Organizations

  • Lehigh University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Detectors
  • Encapsulation
  • Frequency
  • Government Procurement
  • Governments
  • Insertion Loss
  • Losses
  • Measurement
  • Microcapsules
  • Microelectromechanical Systems
  • Military Research
  • Packaging
  • Square Waves
  • Test Methods
  • Voltage

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.