Simulation of Heating of Oil-Cooled Switch Modules

Abstract

I used solid modeling and finite element fluid dynamics codes to simulate the thermal characteristics of switch modules built from silicon carbide bipolar junction transistors (BJTs) and Schottky diodes. The results of the simulation can be used in conjunction with thermal management techniques to mitigate heating of high power, high temperature electronics and minimize the risk of damage during operation.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 2005
Accession Number
ADA441721

Entities

People

  • Gregory K. Ovrebo

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bipolar Junction Transistors
  • Circuit Boards
  • Compound Semiconductors
  • Diodes
  • Dynamics
  • Electronic Components
  • Electronics
  • Elements
  • Fluid Dynamics
  • Heat Transfer
  • High Temperature
  • Schottky Diodes
  • Silicon Carbide
  • Simulations
  • Surface Temperature
  • Temperature Control
  • Transistors

Fields of Study

  • Engineering

Readers

  • Computational Modeling and Simulation
  • Semiconductor Device Technology
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics