Electronic Components for High-g Hardened Packaging

Abstract

A survey of packaging technology applicable to high-g environments is presented. Specifics of the artillery gun launch environment are discussed. The advantages and disadvantages of various external techniques including underfill and potting are also discussed. Discussion of the impact of the manufacturing process and resulting defects is included. Some key failure mechanisms are also identified.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2006
Accession Number
ADA443252

Entities

People

  • Morris S. Berman

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Artillery
  • Drop Tests
  • Electronic Components
  • Electronics
  • Environment
  • Failure Mode And Effect Analysis
  • Gun Launched
  • High Acceleration
  • Manufacturing
  • Materials
  • Mechanical Properties
  • Mechanics
  • Military Research
  • Munitions
  • Packaging
  • Supply Chain Management

Readers

  • Software Engineering
  • ballistics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems