Nonmetals Test and Evaluation. Delivery Order 0001: Alternate Positive Pressure Cure Cycles for 250 deg. F-Curing Epoxy Film Adhesives

Abstract

On-component bonded repairs routinely encounter temperature limitations due to safety considerations and the presence of vulnerable materials or systems in the repair vicinity, such as elastomers and wiring. Due to these limitations, engineers desire the capability to cure epoxy adhesives at temperatures lower than those recommended by the manufacturers. Cytec Engineered Materials' FM 73M and 3M Company's AF 163-2M as well as Henkel's Hysol EA 9628 and Hysol EA 9696 adhesives were evaluated using cure cycles at 200 F and 180 F. Alternate cure times were identified via differential scanning calorimetry to optimize curing at 200 F and 180 F. Tensile lap shear, floating roller peel, and climbing drum peel tests were used to evaluate the corresponding bond strengths. Results obtained in this study proved curing the adhesives at 200 F and 180 F was feasible but led to reduced adhesive mechanical properties.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2006
Accession Number
ADA444630

Entities

People

  • Brett A. Bolan
  • Daniel B. Mccray
  • Jeffrey A. Smith

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Air Force
  • Air Force Research Laboratories
  • Calorimetry
  • Chemical Reactions
  • Climbing
  • Failure Mode And Effect Analysis
  • Glass Transition Temperature
  • Heat Of Reaction
  • Materials
  • Mechanical Properties
  • Peel Strength
  • Physical Properties
  • Shear Strength
  • Test And Evaluation
  • Test Methods
  • Transition Temperature

Fields of Study

  • Materials science

Readers

  • Surface Coatings Technology.
  • Systems Analysis and Design