Creep-Rupture Behavior of a Woven Ceramic Matrix Composite at Elevated Temperatures in a Humid Environment

Abstract

This study focused on moisture and temperature effects on the embrittlement and stress-rupture life of the SiC/SiC CMC Syl-iBN/BN/SiC. The Syl-iBN/BN/SiC is composed of Sylramic fibers with an in-situ layer of boron nitride (Syl-iBN), boron nitride interphase (BN), and SiC matrix. Stress rupture tests and monotonic tests were performed on the specimens. Tests were conducted under 100% humidity and laboratory air environments at three temperatures, 450 C, 750 C, and 950 C. These temperatures were chosen because they fall below the intermediate range, within the range, and above the range, respectively. This study found that while this CMC does experience embrittlement at intermediate temperatures, it also occurs at temperatures above the intermediate range. Scanning Electron Microscopy (SEM) analysis showed the embrittlement and pesting in the specimens increased with time, temperature, and moisture exposure, leading to premature failure. An analysis of the data confirmed that with increase in temperature and exposure to moisture, the stress-rupture life of the Syl-iBN/BN/SiC was considerably shortened

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2006
Accession Number
ADA446193

Entities

People

  • Jennifer L. Ryba

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Space

DTIC Thesaurus Topics

  • Air Force
  • Body Weight
  • Ceramic Materials
  • Ceramic Matrix Composites
  • Composite Materials
  • Electron Microscopy
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Working
  • Mechanics
  • Microscopy
  • Modulus Of Elasticity
  • Tensile Strength

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).
  • Occupational Health and Safety.
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics