Thermoelastic Loss in Microscale Oscillators

Abstract

A simple model of thermoelastic dissipation is proposed for general, free standing microelectromechanical (MEMS) and nanoelectromechanical (NEMS) oscillators. The theory defines a flexural modal participation factor, the fraction of potential energy stored in flexure, and approximates the internal friction by assuming the energy loss to occur solely via classical thermoelastic dissipation of this component of the motion. The theory is compared to the measured internal friction of a high Q mode of a single-crystal silicon double paddle oscillator. The loss at high temperature (above 150 K) is found to be in good agreement with the theoretical prediction. The importance of this dissipation mechanism as a function of scale is briefly discussed. We find that the relative importance of this mechanism scales with the size of the structure, and that for nanoscale structures it is less important than intrinsic phonon phonon scattering.

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Document Details

Document Type
Technical Report
Publication Date
Dec 19, 2001
Accession Number
ADA447731

Entities

People

  • Brian H. Houston
  • D. M. Photiadis
  • J. A. Bucaro
  • J. F. Vignola
  • M. H. Marcus
  • Xiao Liu

Organizations

  • United States Naval Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Energy
  • Frequency
  • Friction
  • Heat Transfer
  • High Temperature
  • Internal Friction
  • Low Temperature
  • Microbalances
  • Microelectromechanical Systems
  • Nanoelectromechanical Systems
  • Nanoscale Devices
  • Oscillators
  • Potential Energy
  • Radio Frequency
  • Resonance
  • Single Crystals
  • Thermal Conductivity

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Plasma Physics / Magnetohydrodynamics
  • Structural Dynamics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems