Fabrication and Characterization of a Micro Turbine/Bearing Rig
Abstract
This paper reports on a process to build, package, and instrument a 5-level wafer-bonded micro-machined turbine/bearing rig. The process flow involves the use of 5 wafers, 16 masks, and 9 deep silicon etching steps. It also utilizes aligned wafer bonding, double-sided deep reactive ion etching (DRIE), and Laser-Assisted-Etching (LAE). The paper also presents experimental results on flow characteristics of the hydrostatic thrust bearings and the preliminary rotational performance of the device.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 2006
- Accession Number
- ADA447928
Entities
People
- Alan H. Epstein
- Arturo A. Ayón
- Chuang-chia Lin
- Dye-zone Chen
- Kenneth S. Breuer
- Martin A. Schmidt
- Reza Ghodssi
- Stuart Jacobson
Organizations
- Massachusetts Institute of Technology