Study on PCB Properties of Epoxy Based Nanocomposites with Different Types of Layered Hybrid Materials
Abstract
The contractor shall investigate: (1) An epoxy/clay nanocomposite matrix material for printed circuit boards, (2) A prepreg for printed circuit boards which contains the epoxy/clay nanocomposite matrix material, and (3) A printed circuit board made with at least one of proposed prepregs.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 26, 2006
- Accession Number
- ADA451629
Entities
People
- Yun D. Park
Organizations
- Seoul National University