Surface Treatments of Fillers to Improve Dielectric Coatings
Abstract
The inability of present dielectric coatings to meet stringent reliability requirements under adverse moisture conditions and broad temperature ranges is one of the major problems facing the electronics industry. Each major class of dielectric material, organic and inorganic, has obvious advantages and disadvantages for use in dielectric coatings. Unfortunately, combinations of these classes usually do not produce coatings which are significantly better than those obtainable with either class of material alone. We, at Melpar, have proposed that to obtain significant improvement in the composite properties of the two classes of dielectrics, improvement at the inorganic-organic interface must be accomplished. To do this we have proposed treatments of the filler surface to enhance the bonding characteristics of the inorganic and organic systems.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1960
- Accession Number
- ADA451827
Entities
People
- Lee M. Kindley
Organizations
- Melpar