Thermomechanical Cycling Investigation of Cu and Niti Reinforced Lead-Free Solder

Abstract

In today,s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and demand improved resistance to creep and low-cycle fatigue in the solder joints. In this study the strengthening of these joints with two different reinforcements is explored: a hard particulate and a shape memory alloy (SMA) single fiber composite (SFC). A baseline is established with a SnAgCu solder that is then compared to test runs on the same solder matrix with Copper particles and then the SMA, Nickel- Titanium wire as reinforcements.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 2006
Accession Number
ADA457206

Entities

People

  • W. S. Horton

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics
  • Biomedical
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Alloys
  • Chemistry
  • Circuit Boards
  • Copper
  • Creep
  • Grain Size
  • Manufacturing
  • Materials
  • Materials Science
  • Particles
  • Phase Transformations
  • Physical Properties
  • Resistance
  • Shape Memory Alloys
  • Strain Gages
  • Thermal Expansion
  • Transition Temperature

Readers

  • Integrated Circuit Design and Technology.
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems