Vibration Testing of Repaired Lead-Tin/Lead-Free Solder Joints (Preprint)

Abstract

Due to growing environmental concerns and recent legislation, tin-lead (Pb-Sn) solders are being phased out by lead-free (LF) solders. The most common Sn-Pb replacement is the tin-silver-copper (Sn-Ag-Cu, SAC) alloys. During the transition phase, it is expected that there will be a period where both Sn-Pb and LF solders will be used side by side, and in conjunction with one another, during assembly processes. Repaired solder joints may also be expected to contain a mixture of Sn-Pb and LF solders, especially in military systems. Tested printed circuit boards were visually inspected for solder cracking and delamination. Metallographic analysis was done on areas where visible cracking or physical damage had occurred. All vibration testing was done at room temperature.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 2006
Accession Number
ADA458169

Entities

People

  • Dale Murry
  • David W. Kleine
  • James L. Smith
  • Martin G. Perez
  • Matthew J. O'keefe
  • Patricia Amick
  • Richard Colfax
  • Steve Vetter

Tags

Communities of Interest

  • Biomedical
  • Space

DTIC Thesaurus Topics

  • Aerospace Industry
  • Air Force
  • Air Force Research Laboratories
  • Circuit Boards
  • Circuits
  • Delamination
  • Electronic Components
  • Failure Mode And Effect Analysis
  • Frequency
  • Governments
  • Manufacturing
  • Materials
  • Printed Circuit Boards
  • Printed Circuits
  • Resonant Frequency
  • Test Equipment
  • Vibration

Readers

  • Facility/Structural Engineering.
  • Integrated Circuit Design and Technology.
  • Surface Engineering/Surface Coating Technology.